Electricity; various kinds, 1—8. Voltaic Batteries; circumstances advantageous or disadvantageous to, 5-13. Proximate cause of Galvanism, 14-18. Quantity or intensity, 18-24. Different forms of Batteries, Couronne des Tasses, Wollaston, &c., 24-31. Adhesion of the hydrogen to the negative plate; amalgamation of the positive, 34. Daniell's Battery, 37-44. Grove's Battery, 45-47. Smee's Battery, 48–55. Comparison between the three, ON THE PROPERTIES OF GALVANIC BATTERIES. Signs of a Battery in action, 59. Harris's galvanometer, 60. Spark, 61. Vol- taic electricity charges in Leyden jar, 62. Phisiological effects, 63. Mag- netism, 64-68. Galvanometers, 68-70. Horseshoe temporary magnet, 71-73. Decomposition cell, voltameters, poles, 74-84. Laws of voltaic decomposition, 85, 86. Table of chemical equivalents, 87. Fluid necessary to decomposition, 88. Conduction of fluids associated with decomposition, 88-90. Intensity necessary for decompositions, 91. Electrolysis; Electro- chemical decomposition, 92-98. Daniell's theory, 99. State of the fluid BOOK THE SECOND. ON ELECTRO-METALLURGY. CHAPTER I. ON THE APPARATUS TO BE EMPLOYED FOR THE REDUCTION OF THE METALS. Electro-metallurgy requires a knowledge of galvanism, 104. The idea of electrometallurgy, suggested by Daniell's battery, 105. The porous tube or single cell apparatus, 106-112. Capillary tube apparatus, 113. Plaster apparatus, 114. Compound battery apparatus, 115, 116. Single battery apparatus, 117, 118. Precipitating trough, 119. Single cell and battery conjoined, 120. Mason's arrangement, 121. Management of the apparatus, 122, 123. Lines on the reduced metal, how to be avoided, 124. Adhesion and non-adhesion of the reduced metal to its mould, 125–128. Apparent adhesion, 128. Lateral growth of the reduced metal, 129. CHAPTER II. ON SUBSTANCES CAPABLE OF RECEIVING THE METALLIC DEPOSIT. Substances on which the deposit may take place, 130-131. Metals, 132-136. Non-conducting substances; Sealing Wax, White Wax, 136-139. Absorbent substances, as Paper and Plaster of Paris, 139–141. Means of rendering them non-absorbent, 141-142. Means of copying non-conducting substances, by Metals, by Plumbago, 143–145. Comparison between the methods, 145, CHAPTER III. ON THE LAWS REGULATING THE REDUCTION OF THE METALS. Metals capable of being reduced by the voltaic fluid, 146. States in which they Law for the reduction Causes of the varieties in the reduc exist, 146-148. Law for the reduction of the metals as a black powder, 148. Law for the reduction of the metals in crystals, 149. of the metals in a reguline state, 150. tion, 150. Mode of producing them, 153–159. Mode of obtaining the black powder, 159. The crystalline state, 160. The reguline state, 161. The same results obtainable by the single cell apparatus, 165. Time required for the deposition of the metals, 167. CHAPTER IV. ON THE REDUCTION OF THE METALS. Reduction of Gold, 168. Reduction of Platinum, 169. Reduction of Palladium, 170. General Remarks, 171. Reduction of Silver from its Nitrate, 172. From its Sulphate, 173. From its Acetate, 174. From its Hypo-Sulphite, 175. From the Ammonio Nitrate, 176. Reduction of Nickel, 177. Reduction of Copper from its Sulphate, 178. From its Nitrate, 179. From its Muriate, 180. From its Acetate, 181. From its Ammoniuret, 182. Copper Positive Pole, 183. Negative Pole, 184. Reduced Copper, 185. Bronzing, 186. Reduction of Zinc, 187. Reduction of Iron, 188. Reduction of Lead, 189. Reduction of Tin, 190. Conclusion, 191. BOOK THE THIRD. ON ELECTRO-GILDING, PLATING, &c. General directions, 192. Voltaic gilding, 193. Single cell apparatus, 194. Battery apparatus, 195. Copper gilding, 196. Water gilding, 197. Gilding by amalgamation, 198. Voltaic platinating; Voltaic platinizing, 199. Voltaie palladiating, 200. Voltaic plating, 201. On coating metals with nickel, 203. On coppering metallic substances, 204. On coppering non-metallic substances, 205. On coppering medallions, 206.-Fruit, vegetables, &c., 207.-Baskets, 208.-Earthenware, 209. On coating metals with iron, zinc, &c., 210. Conclusion, 211. BOOK THE FOURTH. ON VARIOUS APPLICATIONS OF THE REDUCTION OF METALS BY GALVANISM. CHAPTER I. ON THE MULTIPLICATION OF COINS AND MEDALS. Value of electro-metallurgy for the numismatist, 212. Mode of obtaining the mould, 213.-Directly by the voltaic current, 214.-By lead, fusible metal, &c. Metallic duplicates of gold, 217. Copper medals, 220. PrecauApparatus to be employed, 222. 215. —By non-conducting substances, 216. Silver medals, 218. Medals of platinum, 219. tions to be taken to prevent air bubbles, 221. Single cell apparatus, 223. Thickness of the metal, 224. Removal of the cast Value of electro-metallurgy for medallists, 226. AdOn the modes of making perfect medals, 228. from the mould, 225. ditional advantages, 227. CHAPTER II. ON COPYING SEALS, PLASTER CASTS, &c. Value of a seal, 229. Process for copying a seal, 230. Copper moulds from plaster medallions, 231. Quality of the reduced copper, 232. CHAPTER III. ON THE MULTIPLICATION OF BRASSES. Process for obtaining Duplicate Brasses, 233. CHAPTER IV. ON MAKING DIES FROM EMBOSSED SURFACES. On metallic reverses from raised surfaces by galvanic agency, 234. Peculiarities of dies made from paper, 235. CHAPTER V. ON THE MANUFACTURE OF MOULDS FROM FRUITS, VEGETABLES, &c. On making moulds from vegetable substances, 236. Chantrey's method, 237. CHAPTER VI. ON THE APPLICATION OF ELECTRO-METALLURGY TO SCULPTURE AND OTHER PURPOSES. The mode the sculptor adopts to obtain a metallic cast, 238. On making a metallic cast by electro-metallurgy, 239. The texture of the copper, 240. General remarks, 241. On the application of electro-metallurgy for goldsmiths, 242. For surgeons, &c., 243. ON THE MULTIPLICATION OF PLAIN COPPER PLATES. The preparation of plain copper plates, 247. The electrotype plates, 248. Process for their manufacture, 249. Manipulation of the battery, 250. Precipitating trough, 251. Temperature, 252. Positive pole, 253. Regulation of the texture of the copper, 254. Single cell apparatus, 255. Time required for the process, 256. Removal of the plate, 257. Mode of preparing the plate for engravers, 258. Economy in the manufactory, 259. Expense of the plate, 260. ON COPYING ENGRAVED COPPER PLATES. Engraved copper plates, 261. Design on the plates, 262. Various kinds of engraving, 263. Uses of engvaved plates, 264.-For the potteries, 265.-For calico printers, 266. CHAPTER IV. ON THE MULTIPLICATION OF STEEL PLATES. Process for making a copper plate from a steel one, 267. Perkins's apparatus, 268. Comparison between the two processes, 269. |
